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Job Description:

As a Copper Plating Finish Unit Process Engineer with Broadcom's Wireless Semiconductor Division (WSD), you will own and support equipment used to develop advanced processes in our state of the art 8" wafer fabrication facility located along the Front Range Mountains in Northern Colorado. You will team with Technology Development and Equipment Engineering to achieve this objective. The team will be challenged by new materials, applications and device architectures. You will be responsible for establishing robust equipment and processes through rigorous characterization and statistical validation before ramping them into high volume manufacturing. Fabrication technologies will include silicon based MEMS and compound semiconductor active devices. Primary focus will be on Finish equipment.

  • Ownership of new TSV copper plating process. This will include sustaining high volume manufacturing lines, as well as some new process, materials, and applications development.
  • Yield, quality and cost improvements to existing unit processes, to deliver highly robust and consistent results in collaboration with equipment maintenance and operational organizations.
  • New equipment selection, acceptance and start-up as well as hardware and software optimization/upgrades; conferring with equipment vendors and manufacturing engineers at Broadcom Limited.
  • Development and characterization of robust solutions to R&D needs in collaboration with development engineering groups.
  • Experimental design and data analysis to support the line sustaining work, process development and process improvements. Solid identification and resolution of yield and defect issues with clear communication of results across the organization.
  • Work with peers and the unit equipment engineering/maintenance teams to establish project objectives, schedules and resource profiles for projects. Organizes and manages longer term improvement projects to meet organizational goals.
  • Collaborate with Equipment Engineering, Equipment Maintenance and Manufacturing Operations to achieve robust performance in support of yield, quality, cost and productivity goals; reporting and ownership of related projects and metrics.
  • Implement robust monitoring methodologies enabling early detection of excursions in equipment performance before product is impacted (e.g. SPC, FDC, baselining & matching).

Job Qualifications
  • BS in ChE, EE, ME, Chemistry, Physics or Materials Science and a minimum of 8+ years of experience as a TSV Plating engineer in a semiconductor HVM environment. Or MS in EE, ME, ChE, Materials Science, Physics or Chemistry and 6+ years related experience
  • Experience with TSV Plating equipment (i.e. LAM Sabre 3D (preferred), Applied Materials Raider/Nokota) is required.
  • Detail oriented with strong fundamentals in core process engineering fundamentals.
  • Understanding of general processing techniques and concepts for silicon based MEMS devices applications including interdependencies with other unit processes.
  • Strength in Statistical Process Control for a high volume manufacturing facility. Mature data analysis skills using tools such as JMP, Minitab, Spotfire and Excel/Access is required.
  • Candidates with practical experience in Fault Detection & Classification (FDC) systems, Copy Exactly (CE!) methodology, High Precision Maintenance (HPM), TPS, and Lean will be considered preferentially.
  • Proven ability to work in a dynamic environment and deliver results.
  • Strong troubleshooting skills.
  • Excellent ownership, initiative and communication skills.
  • Track record of self-motivated and collaborative learning.
  • Ability to prioritize and multitask.
  • Strong cross functional teamwork skills and demonstrated ability to deliver improvements within a team environment.
  • Attention to detail is essential.
  • Legal authorization to work in the U.S. is required
  • Initiative to address and appropriately escalate problems to achieve rapid resolution.

Additional Job Description:

Compensation and Benefits

This annual base salary range for this position is $85,200 - $142,000.

This position is also eligible for a discretionary annual bonus in accordance with the relevant plan documents and equity in accordance with equity award agreements.

Broadcom offers a competitive and comprehensive benefits package including but not limited to the following: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all national and state requirements for Paid Family Leave and other leaves of absence.

The foregoing information is provided in compliance with the Colorado Equal Pay for Equal Work Act and is the company's good faith and reasonable estimate of the compensation range and benefits offered for this position. The compensation offered to the successful applicant may vary based on factors including experience, skills, education, location, and other job-related reasons.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, gender identity, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Job Information

  • Job ID: 60854894
  • Location:
    Colorado, United States
  • Position Title: Finish Team Process Engineer - Plating
  • Company Name: Broadcom
  • Job Type: Full-Time
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